Liquid crystal panel and thin film transistor array substrate thereof

ABSTRACT

A thin film transistor (TFT) array substrate includes: a substrate; a display region formed on the substrate; a flexible printed circuit disposed on the substrate and located at one side of the display region; a control chip disposed between the display region and the flexible printed circuit, and two sides of the flexible printed circuit going beyond two corresponding sides of the control chip, respectively; a first reinforcement member disposed at a first side of the control chip, and the first side being adjacent to one side of the control chip that faces the display region; a second reinforcement member disposed at a second side of the control chip opposite to the first side; and a third reinforcement member covering the control chip, the first reinforcement member and the second reinforcement member.

CROSS REFERENCE TO RELATED APPLICATIONS

This is a continuation application of co-pending patent application Ser.No. 15/327,996, filed on Jan. 20, 2017, which is a national stage of PCTApplication Number PCT/CN2016/089973, filed on Jul. 14, 2016, claimingforeign priority of Chinese Patent Application Number 201610349589.4,filed on May 24, 2016.

TECHNICAL FIELD

The present invention belongs to a technical field of a liquid crystaldisplay, in particular, relates to a liquid crystal panel and a thinfilm transistor array substrate thereof.

BACKGROUND ART

A gradual progress of photoelectric and semiconductor technology drivesa flourish of a flat panel display, while in various flat paneldisplays, a liquid crystal display (LCD) has been applied to variousaspects in a product life due to its superior characteristics such ashigh space utility efficiency, low power consumption, radiation-free andlow electromagnetic interference etc.

The existing liquid crystal displays are mostly backlight liquid crystaldisplays, which include a liquid crystal panel and a backlight module. Aworking principle of the liquid crystal panel is placing liquid crystalmolecules between two parallel glass substrates, there are a pluralityof vertical and horizontal thin wires between the two glass substrates,and a direction change of the liquid crystal molecule is controlled bypower on or not, to refract light rays of the backlight module togenerate a picture.

Generally, the liquid crystal panel is composed of a color filter (CF)substrate, a thin film transistor (TFT) array substrate, a liquidcrystal (LC) interposed between the CF substrate and the TFT arraysubstrate, and a sealant.

At present, a display driving chip (or called a control chip) on the TFTarray substrate usually uses a manner of a chip on glass (COG) substrateto perform a mounting. Advantages of using the above manner lie in:reducing welding process, having a greatly reduced volume with respectto a manner of a chip on board (COB), easier for miniaturization,facilitation and high integration, and there being not problems such aschip deformation etc.

However, a length of the display driving chip is smaller than a width ofa region (i.e., a display region) occupied by the TFT, so that the areaoccupied by the display driving chip becomes a region in which strengthis weakest in the whole TFT array substrate. Meanwhile, the displaydriving chip is directly mounted on the TFT array substrate, causingthat there is no space of making static electricity protection measuresbetween the display driving chip and the display region. The above twoproblems will reduce yield rate of the liquid crystal panel.

SUMMARY

In order to solve the problem existing in the prior art, a purpose ofthe present invention is to provide a thin film transistor (TFT) arraysubstrate which includes: a substrate; a plurality of thin filmtransistors (TFTs) arranged on the substrate in an array form, wherein aregion occupied by the plurality of TFTs is a display region; a flexibleprinted circuit disposed on the substrate and located at one side of thedisplay region; a control chip disposed between the display region andthe flexible printed circuit, and two sides of the flexible printedcircuit going beyond two corresponding sides of the control chip,respectively; a first reinforcement member disposed at a first side ofthe control chip, and the first side being adjacent to one side of thecontrol chip that faces the display region; a second reinforcementmember disposed at a second side of the control chip opposite to thefirst side; and a third reinforcement member covering the control chip,the first reinforcement member and the second reinforcement member.

Further, upper surfaces of the first reinforcement member and the secondreinforcement member are aligned with an upper surface of the controlchip.

Further, both the first reinforcement member and the secondreinforcement member include: a reinforcement body, a first gluereceiving groove formed by one side of the reinforcement body that facesthe display region being recessed, and a second glue receiving grooveformed by a connection of one side of the reinforcement body that facesthe control chip with one side of the reinforcement body that isopposite to the display region being recessed.

Further, end portions of the flexible printed circuit that go beyondsides of the control chip are engaged in the second glue receivinggroove.

Further, the third reinforcement member includes: a reinforcement body,and two third glue receiving grooves formed by two ends of thereinforcement body that face one side of the display region beingrecessed respectively.

Further, the third glue receiving groove corresponds to the first gluereceiving groove up and down.

Further, glues are spilled into the first glue receiving groove, thesecond glue receiving groove and the third glue receiving groove, so asto fix the first reinforcement member, the second reinforcement memberand the third reinforcement member.

Further, the TFT array substrate further includes: a conductive tapedisposed on the third reinforcement member; one end of the conductivetape extending to a region between the display region and the controlchip, to electrically connect the control chip; and the other end of theconductive tape extending to the flexible printed circuit, toelectrically connect a ground terminal on the flexible printed circuit.

Further, the first reinforcement member, the second reinforcement memberand the third reinforcement member are all made of polyethyleneterephthalate (PET).

Another purpose of the present invention is further to provide a liquidcrystal panel which includes the above TFT array substrate.

Advantageous effects of the present invention are as follows: thepresent invention disposes reinforcement members around the controlchip, to enhance strength of the area occupied by the control chip, andconnects the control chip and a ground point on the flexible printedcircuit through the conductive tape disposed on the third reinforcementmember. Thus, an interference to the control chip from an ambientenvironment can be shielded efficiently, and meanwhile, staticelectricity can flow to the ground point of the flexible printed boardfrom the conductive tape directly, so as to avoid static damage for thecontrol chip caused by the static electricity.

BRIEF DESCRIPTION OF THE DRAWINGS

The above and/or other aspects, characteristics and advantages of theembodiments of the present invention will become apparent from thefollowing description, taken in conjunction with the accompanyingdrawings in which:

FIG. 1 is a stereo exploded view of a thin film transistor (TFT) arraysubstrate according to an embodiment of the present invention;

FIG. 2 is a structural schematic view of a first reinforcement member, asecond reinforcement member and a third reinforcement member accordingto an embodiment of the present invention;

FIG. 3 is a side view of a liquid crystal panel according to anembodiment of the present invention; and

FIG. 4 is an A-A reference arrow view in FIG. 3.

DETAILED DESCRIPTION OF EXEMPLARY EMBODIMENTS

Embodiments of the present invention will be described in detail belowby referring to the accompany drawings. However, the present disclosurecan be implemented in numerous different forms, and the presentdisclosure should not be explained to be limited to the particularembodiments set forth herein. Instead, these embodiments are providedfor explaining the principle and actual application of the presentdisclosure, and thus other skilled in the art can understand variousembodiments and amendments which are suitable for specific intendedapplications of the present disclosure.

In the drawings, to be clear, thicknesses of a layer and a region may beexaggerated. The same reference numerals denote the same components inthe drawings throughout.

It will be understood that, even though terms of “first”, “second”, etc.here can be used to describe various components, these components shouldnot be limited by these terms. The terms are only used to distinguishone component from another component.

FIG. 1 is a stereo exploded view of a thin film transistor (TFT) arraysubstrate according to an embodiment of the present invention.

Referring to FIG. 1, a thin film transistor (TFT) array substrate 10according to an embodiment of the present invention includes: asubstrate 11; a display region 12 formed on the substrate 11, whereinthe display region 12 is formed by a region occupied by a plurality ofthin film transistors (TFTs) (not shown) that are arranged on thesubstrate 11 in an array form; a flexible printed circuit (FPC) 13disposed on the substrate 11 and located at one side of the displayregion 12; a control chip (or called a display driving chip) 14 disposedon the substrate 11 and located between the display region 12 and theFPC 13, wherein two sides of the FPC 13 go beyond two correspondingsides of the control chip 14, respectively; a first reinforcement member15 disposed at a first side of the control chip 14, wherein the firstside of the control chip 14 is adjacent to one side of the control chip14 that faces the display region 12; a second reinforcement member 16disposed at a second side of the control chip 14, wherein the secondside of the control chip 14 is opposite to the first side thereof; and athird reinforcement member 17 covering the control chip 14, the firstreinforcement member 15 and the second reinforcement member 16. Hence,strength of the area occupied by the control chip 14 is enhanced bydisposing reinforcement members around the control chip 14.

Further, the TFT array substrate 10 according to the embodiment of thepresent invention further includes: a conductive tape 18 disposed on thethird reinforcement member 17. The conductive tape 18 is used to connectthe control chip 14 and a ground point on the FPC 13. Thus, interferenceto the control chip 14 from an ambient environment can be shieldedefficiently, and meanwhile, static electricity can flow to the groundpoint of the FPC 13 from the conductive tape 18 directly, so as to avoidstatic damage for the control chip 14 caused by the static electricity.

FIG. 2 is a structural schematic view of a first reinforcement member, asecond reinforcement member and a third reinforcement member accordingto an embodiment of the present invention.

Referring to FIGS. 1 and 2, the first reinforcement member 15 accordingto the embodiment of the present invention includes: a firstreinforcement body 151, a first glue receiving groove 152 formed by oneside of the first reinforcement body 151 that faces the display region12 being recessed, and a second glue receiving groove 153 formed by aconnection of one side of the first reinforcement body 151 that facesthe control chip 14 with one side of the first reinforcement body 151that is opposite to the display region 12 being recessed.

Similarly, the second reinforcement member 16 according to theembodiment of the present invention includes: a second reinforcementbody 161, a third glue receiving groove 162 formed by one side of thesecond reinforcement body 161 that faces the display region 12 beingrecessed, and a fourth glue receiving groove 163 formed by a connectionof one side of the second reinforcement body 161 that faces the controlchip 14 with one side of the second reinforcement body 161 that isopposite to the display region 12 being recessed.

The third reinforcement member 17 according to the embodiment of thepresent invention includes: a third reinforcement body 171, and twofifth glue receiving grooves 172 formed by two ends of the thirdreinforcement body 171 that face one side of the display region 12 beingrecessed respectively.

When the third reinforcement member 17 covers the control chip 14, thefirst reinforcement member 15 and the second reinforcement member 16,one of the two fifth glue receiving grooves 172 is overlapped andaligned with the first glue receiving groove 152 up and down, and theother one of the two fifth glue receiving grooves 172 is overlapped andaligned with the third glue receiving groove 162 up and down.

When the first reinforcement member 15, the second reinforcement member16 and the third reinforcement member 17 are fixed, two sides of thecontrol chip 14 may be coated with glues having a certain length andthickness, and then the first reinforcement member 15, the secondreinforcement member 16 are bonded to the two sides of the control chip14 respectively, and the third reinforcement member 17 is covered on thecontrol chip 14, the first reinforcement member 15 and the secondreinforcement member 16. In the pressing process, the glues are spilledinto the respective glue receiving grooves, so as to complete fixing thefirst reinforcement member 15, the second reinforcement member 16 andthe third reinforcement member 17. Please refer to FIGS. 3 and 4 fordetails.

FIG. 3 is a side view of a liquid crystal panel according to anembodiment of the present invention. FIG. 4 is an A-A reference arrowview in FIG. 3.

Referring to FIGS. 3 and 4, the liquid crystal panel according to theembodiment of the present invention includes: a thin film transistor(TFT) array substrate 10; a color filter (CF) substrate 20 disposed bycombining with the TFT array substrate 10; and a liquid crystal layer(not shown) interposed there-between.

An area of the CF substrate 12 substantially corresponds to an area ofthe display region 12 of the TFT array substrate 10. In general, the CFsubstrate 12 includes necessary parts such as a color resist, a blackmatrix, and an alignment film layer and so on.

The first reinforcement member 15 and the second reinforcement member 16are bonded to two sides of the control chip 14 through glues 19,respectively. Further, the first reinforcement member 15 and the secondreinforcement member 16 are raised through the glues 19 between thefirst reinforcement member 15 and the substrate 11 and between thesecond reinforcement member 16 and the substrate 11, so as to align bothupper surfaces of the first reinforcement member 15 and the secondreinforcement member 16 with the upper surface of the control chip 14,thereby disposing the third reinforcement member 17 conveniently.

When the first reinforcement member 15 and the second reinforcementmember 16 are bonded to two sides of the control chip 14 through theglues 19, respectively, the second glue receiving groove 153 and thefourth glue receiving groove 163 are engaged with end portions of theFPC 13 that go beyond sides of the control chip 14, respectively.

The conductive tape 18 is disposed on the third reinforcement member 17.On end of the conductive tape 18 extends to a region between the displayregion 12 and the control chip 14 and extends to the CF substrate 12, toelectrically connect the control chip 14; and the other end of theconductive tape 18 extends to the FPC 13, to electrically connect aground point on the FPC 13.

In addition, in the present embodiment, the first reinforcement member15, the second reinforcement member 16 and the third reinforcementmember 17 are all made of polyethylene terephthalate (PET), while thepresent invention is not limited thereto.

Although the present invention is described with reference to thespecial embodiments, it will be understood by those skilled in the artthat various changes in form and details may be made therein withoutdeparting from the spirit and scope of the invention as defined by theappended claims and its equivalents.

The invention claimed is:
 1. A thin film transistor (TFT) arraysubstrate, comprising: a substrate; a plurality of thin film transistors(TFTs) arranged on the substrate in an array form, wherein a regionoccupied by the plurality of TFTs is a display region; a flexibleprinted circuit disposed on the substrate and located at one side of thedisplay region; a control chip disposed between the display region andthe flexible printed circuit, and two sides of the flexible printedcircuit going beyond two corresponding sides of the control chip,respectively; a first reinforcement member disposed at a first side ofthe control chip, and the first side being adjacent to one side of thecontrol chip that faces the display region; a second reinforcementmember disposed at a second side of the control chip opposite to thefirst side; and a third reinforcement member covering the control chip,the first reinforcement member and the second reinforcement member,wherein the first reinforcement member and the second reinforcementmember are respectively bonded to the substrate at the first and secondsides of the control chip through glues applied between the first andsecond reinforcement members and the substrate such that the firstreinforcement member and the second reinforcement member are raised bythe glues that are provided between the first and second reinforcementmembers and the substrate so as to have upper surfaces of the first andsecond reinforcement members aligned with an upper surface of thecontrol chip; and wherein both the first reinforcement member and thesecond reinforcement member comprise: a reinforcement body, a first gluereceiving groove formed by one side of the reinforcement body that facesthe display region being recessed, and a second glue receiving grooveformed by a connection of one side of the reinforcement body that facesthe control chip with one side of the reinforcement body that isopposite to the display region being recessed.
 2. The TFT arraysubstrate of claim 1, wherein end portions of the flexible printedcircuit that go beyond sides of the control chip are engaged in thesecond glue receiving groove.
 3. The TFT array substrate of claim 2,wherein the third reinforcement member comprises: a reinforcement body,and two third glue receiving grooves formed by two ends of thereinforcement body that face one side of the display region beingrecessed respectively.
 4. The TFT array substrate of claim 3, whereinthe third glue receiving groove corresponds to the first glue receivinggroove up and down.
 5. The TFT array substrate of claim 4, wherein gluesare spilled into the first glue receiving groove, the second gluereceiving groove and the third glue receiving groove, so as to fix thefirst reinforcement member, the second reinforcement member and thethird reinforcement member.
 6. The TFT array substrate of claim 1,wherein the third reinforcement member comprises: a reinforcement body,and two third glue receiving grooves formed by two ends of thereinforcement body that face one side of the display region beingrecessed respectively.
 7. The TFT array substrate of claim 6, whereinthe third glue receiving groove corresponds to the first glue receivinggroove up and down.
 8. The TFT array substrate of claim 7, wherein gluesare spilled into the first glue receiving groove, the second gluereceiving groove and the third glue receiving groove, so as to fix thefirst reinforcement member, the second reinforcement member and thethird reinforcement member.
 9. The TFT array substrate of claim 1,further comprising: a conductive tape disposed on the thirdreinforcement member; one end of the conductive tape extending to aregion between the display region and the control chip, to electricallyconnect the control chip; and the other end of the conductive tapeextending to the flexible printed circuit, to electrically connect aground terminal on the flexible printed circuit.
 10. The TFT arraysubstrate of claim 1, wherein the first reinforcement member, the secondreinforcement member and the third reinforcement member are all made ofpolyethylene terephthalate (PET).
 11. A liquid crystal panel, comprisinga thin film transistor (TFT) array substrate and a color filtersubstrate coupled with each other, and a liquid crystal layer interposedbetween the TFT substrate and the color filter substrate, wherein theTFT array substrate comprises: a substrate; a plurality of thin filmtransistors (TFTs) arranged on the substrate in an array form, wherein aregion occupied by the plurality of TFTs is a display region; a flexibleprinted circuit disposed on the substrate and located at one side of thedisplay region; a control chip disposed between the display region andthe flexible printed circuit, and two sides of the flexible printedcircuit going beyond two corresponding sides of the control chip,respectively; a first reinforcement member disposed at a first side ofthe control chip, and the first side being adjacent to one side of thecontrol chip that faces the display region; a second reinforcementmember disposed at a second side of the control chip opposite to thefirst side; and a third reinforcement member covering the control chip,the first reinforcement member and the second reinforcement member,wherein the first reinforcement member and the second reinforcementmember are respectively bonded to the substrate at the first and secondsides of the control chip through glues applied between the first andsecond reinforcement members and the substrate such that the firstreinforcement member and the second reinforcement member are raised bythe glues that are provided between the first and second reinforcementmembers and the substrate so as to have upper surfaces of the first andsecond reinforcement members aligned with an upper surface of thecontrol chip; and wherein both the first reinforcement member and thesecond reinforcement member comprise: a reinforcement body, a first gluereceiving groove formed by one side of the reinforcement body that facesthe display region being recessed, and a second glue receiving grooveformed by a connection of one side of the reinforcement body that facesthe control chip with one side of the reinforcement body that isopposite to the display region being recessed.
 12. The liquid crystalpanel of claim 11, wherein end portions of the flexible printed circuitthat go beyond sides of the control chip are engaged in the second gluereceiving groove.
 13. The liquid crystal panel of claim 11, wherein thethird reinforcement member comprises: a reinforcement body, and twothird glue receiving grooves formed by two ends of the reinforcementbody that face one side of the display region being recessedrespectively.
 14. The liquid crystal panel of claim 13, wherein thethird glue receiving groove corresponds to the first glue receivinggroove up and down.
 15. The liquid crystal panel of claim 14, whereinglues are spilled into the first glue receiving groove, the second gluereceiving groove and the third glue receiving groove, so as to fix thefirst reinforcement member, the second reinforcement member and thethird reinforcement member.
 16. The liquid crystal panel of claim 11,further comprising: a conductive tape disposed on the thirdreinforcement member; one end of the conductive tape extending to aregion between the display region and the control chip, to electricallyconnect the control chip; and the other end of the conductive tapeextending to the flexible printed circuit, to electrically connect aground terminal on the flexible printed circuit.
 17. The liquid crystalpanel array substrate of claim 11, wherein the first reinforcementmember, the second reinforcement member and the third reinforcementmember are all made of polyethylene terephthalate (PET).